Kontaktlose Chipkarte

摘要

Method for the manufacture of a contactless smart card (10) in which step 1 involves securing the chip (14) with contact pads (16a, 16b) on one of its surfaces in a mould defining a smart card substrate (12) so that the surface of the smart card with the contact pads is substantially located on the same plane as the surface of the substrate (12) which is defined by the mould. A smart card substrate material is also fed into the mould, whereupon a coil structure (18) is applied to the substrate (12) by screen printing by means of a conductive paste so that the coil structure (18) extends to the contact pads (16a, 16b) of the smart card.