| 摘要 |
<p>A gas inlet (40), which also serves as a counter electrode, is located inside of a vacuum chamber (14) made of an electrically insulating material. A container (12) is mounted on a mandrel (92) mounted on the gas inlet (40). The chamber (14) is evacuated to a subatmospheric pressure. A process gas (54) is then introduced into the container (12) through the gas inlet (40). The process gas is ionized by coupling RF power (88) to a main electrode (86) located adjacent an exterior surface of the chamber (14) and to the gas inlet (40) which deposits a plasma enhanced chemical vapor deposition (PECVD) thin film onto the interior surface of the container (12).</p> |
