HIGH DENSITY CONNECTOR AND METHOD OF MANUFACTURE

摘要

Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also disclosed is a method for manufacturing such connectors. In one embodiment, a connector assembly includes a substrate having a major surface and a conductive element. A surface mount electrical connector is adapted to be mounted on the major surface of the substrate. The connector includes a contact having a connector portion adapted to be located a distance from the major surface and a body of reflowable, electrically conductive material disposed on the connector portion and adapted to engage the conductive element so that the body provides the primary electrical current path between the connector and the substrate.