发明名称 PHASE-SEPARATION STRUCTURE, RESIN COMPOSITION COMPRISING SAID STRUCTURE, MOLDING MATERIAL FOR SEALING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT DEVICE
摘要 <p>A phase-separation structure comprising a phenoxy resin modified with a carboxylated elastomer, prepared from a phenoxy resin and a carboxylated elastomer, the resin and the elastomer constituting a phase-separation structure, wherein the light transmittance of the structure in a 75 νm-thick film form at a wavelength of 500 nm is not less than 10 % of the light transmittance of the air.</p>
申请公布号 WO1998015597(P1) 申请公布日期 1998.04.16
申请号 JP1997003617 申请日期 1997.10.08
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