摘要 |
The invention aims at improving the temperature resisting cycle characteristics after mounting and moisture absorption resiting reflow characteristics of a chip-mounted semiconductor, and provides an adhesive which functions as a bonding member (3) to be used when a semiconductor chip (6) is mounted on an organic supporting substrate (4) and which has storage moduli at 25 DEG C and at 260 DEG C as measured with a dynamic visco-elasticity measuring instrument of 10-2000 MPa and 3-50 MPa, respectively, a double-coated adhesive film produced therewith, a semiconductor device, an semiconductor chip mounting substrate, and methods of manufacturing these products. |
申请人 |
HITACHI CHEMICAL COMPANY, LTD.;YAMAMOTO, KAZUNORI;SHIMADA, YASUSHI;KUMASHIRO, YASUSHI;INADA, TEIICHI;KURIYA, HIROYUKI;KANEDA, AIZOU;TOMIYAMA, TAKEO;NOMURA, YOSHIHIRO;HOSOKAWA, YOICHI;KIRIHARA, HIROSHI;KAGEYAMA, AKIRA |
发明人 |
YAMAMOTO, KAZUNORI;SHIMADA, YASUSHI;KUMASHIRO, YASUSHI;INADA, TEIICHI;KURIYA, HIROYUKI;KANEDA, AIZOU;TOMIYAMA, TAKEO;NOMURA, YOSHIHIRO;HOSOKAWA, YOICHI;KIRIHARA, HIROSHI;KAGEYAMA, AKIRA |