发明名称 Relay modules circuit board e.g. for automobile
摘要 A circuit board for electrical module, includes a carrier plate (2) as a moulded plastics part with conductor paths joined to it, the conductor paths being formed of at least one stamped grid-pattern (3). The electrical, in particular electromechanical components (10,11), such as relays, inserted into the circuit board (1) are electrically connected via the conductor paths. The circuit board (2) has openings (13), located immediately next to the contact lugs (6) which are bent out of the stamped grid plane, for plug-in fixture of electrical components (10,11). The conductor paths are positioned side of the carrier plate (2) and fixed by deformable plastics webs (12) of the carrier plate.
申请公布号 DE19707709(C1) 申请公布日期 1998.04.16
申请号 DE19971007709 申请日期 1997.02.26
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 TONEJC, VINKO, 13469 BERLIN, DE
分类号 H05K1/02;H01H50/02;H01H50/04;H05K3/00;H05K3/20;H05K3/32;H05K3/40;(IPC1-7):H05K7/02 主分类号 H05K1/02
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