Verfahren und Vorrichtung zum Behandeln von Substraten

摘要

The invention concerns a method of treating substrates (3) in a treatment fluid (9), the substrates (3) being lifted into and out of said fluid by means of a lifting device. According to the invention, this operation can be carried out very simply with high productivity and such that square or rectangular substrates can also be treated in that the substrates (3) are partially lifted out of the treatment fluid (9) by a pick-up device (1) and are then taken over by a dry second pick-up device (2) and lifted out completely. A device displaying these advantages comprises a first pick-up device (1) for partially lifting the substances (3) out of the treatemnt fluid, and a second dry pick-up device (2) for taking over the substrates (3) and lifting them out completely.