发明名称 DOUBLE HALF VIA ANTIFUSE
摘要 <p>An antifuse comprises a substantially planar conductive lower electrode covered by a first layer of silicon nitride. A layer of amorphous silicon is disposed over the silicon nitride layer. A first dielectric layer is disposed over the surface of the amorphous silicon layer and has a first aperture therethrough communicating with the amorphous silicon layer. A second layer of silicon nitride is disposed over the first dielectric layer and in the first aperture. A conductive upper electrode, such as a layer of titanium nitride, is disposed over the second layer of silicon nitride. A second dielectric layer is disposed over the surface of the conductive upper electrode and has a second aperture therethrough in alignment with the first aperture communicating with the conductive upper electrode. An overlying metal layer is disposed over the surface of the second dielectric layer and in the second aperture making electrical contact with the conductive upper electrode.</p>
申请公布号 EP0835525(A1) 申请公布日期 1998.04.15
申请号 EP19960916763 申请日期 1996.05.29
申请人 ACTEL CORPORATION 发明人 MCCOLLUM, JOHN, L.
分类号 H01L23/52;H01L21/3205;H01L21/768;H01L21/82;H01L23/525;H01L23/532;(IPC1-7):H01L23/525 主分类号 H01L23/52
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