发明名称 |
Housing for electronic equipment made of a polyamide resin composition |
摘要 |
A polyamide resin composition comprising 100 parts by weight of a resin composition comprised of 20 to 80% by weight of an aromatic polyamide resin and 80 to 20% by weight of a modified polyphenylene ether resin (the total amount in% by weight of the aromatic polyamide resin and the modified polyphenylene ether resin being 100% by weight) and, incorporated in the resin composition, 0.5 to 30 parts by weight of a liquid-crystalline polymer, 0.01 to 3 parts by weight of a compatibilizing agent and 2 to 40 parts by weight of an inorganic filler and optionally a rubber component. The plate thickness of the resin molded articles may be reduced to 2 mm or less, and even further to 1 mm or less without deterioration of the properties thereof. <IMAGE> <IMAGE> |
申请公布号 |
EP0611805(B1) |
申请公布日期 |
1998.04.15 |
申请号 |
EP19930306979 |
申请日期 |
1993.09.03 |
申请人 |
FUJITSU LIMITED |
发明人 |
NISHII, KOTA;KIMURA, KOUICHI;ISHIZUKA, MASANOBU;ADACHI, KATSURA |
分类号 |
C08K3/34;C08K5/35;C08K7/02;C08L51/08;C08L67/00;C08L71/12;C08L77/00;C08L77/10;C08L77/12;H01B3/30 |
主分类号 |
C08K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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