| 摘要 |
The present invention provides in combination, a radiant panel heating system, configured for ease of installation and maintenance which also provides the structural characteristics required of a subflooring panel within a floor framing system. The system consists of structural subflooring panels (2) with grooves arrayed in a modular geometry. The panels are overlaid with a heat-conducting surface embossed with a matching groove pattern. The panels are capable of being fastened to a variety of floor support structures (1) in a manner typical of subfloor panels, which fulfill a structural requirement only while simultaneously interacting to create an array of approximately evenly spaced grooves into which tubing (4) or wire of the type used in hydronic or electric radiant panel heating is installed. |
