| 摘要 |
An assembly is provided with a semiconductor chip mounted on the main surface side of a die pad of a lead frame. The semiconductor chip is connected with a lead via bonding wire. The assembly is inserted into a transfer molding die for resin sealing, wherein the die temperature of a lower die is set higher than the die temperature of an upper die, and the transfer molding is carried out. Specifically, the die surface temperature of the lower die disposed at the main surface side of the lead frame is set higher by +5 DEG to +15 DEG C. than the die surface temperature (170 DEG C.) of the upper die disposed at the rear surface side to carry out molding. This reduces the viscosity of the sealing resin flowing into the rear surface side to increase fluidity of the resin, and a thin resin layer can be positively molded without insufficient resin filling at the rear surface side where the flow path cross sectional area in the cavity is small.
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