| 摘要 |
<p>PROBLEM TO BE SOLVED: To correct mask shape easily with high precision even by a simple method by obtaining a relationship between a load given to a mask structure and a mask pattern displacement amount, and using a method for controlling a load to be given by the relationship. SOLUTION: Firstly, magnification of a mask and a wafer pattern is measured with an alignment measurement system, to obtain a set load given to the mask for a required magnification correction. Here, a mask pattern displacement amount for the set load given to the mask which is obtained in advance and stored in a control device 25 is utilized. Then a voltage is applied to a PZT actuator 21 so that a load detected by a load cell 22 is the set load. With servo control driven by the PZT actuator 21 based on the output from the load cell 22, a constant amount of load is always applied to a mask structure even when minute movement, etc., takes place, for correction including a pattern magnification change due to thermal strain under exposure light.</p> |
