发明名称 PRODUCTION OF FILM FOR RETORT PACKING
摘要 PROBLEM TO BE SOLVED: To obtain excellent impact resistance and sealability by integrally laminating and molding an outer layer composed of a heatresistant polyamide resin layer, an intermediate layer composed of an adhesive resin layer and an inner layer composed of a mixture consisting of a specific amt. of a random copolymer polypropylene resin and a polypropylene type soft resin. SOLUTION: 'Nylon' as a heat-resistant polyamide resin layer being an outer layer, a maleic anhydride grafted acid modified random copolymer polypropylene type resin as an interlaminar adhesive resin layer and a mixture of 90wt.% of random copolymer polypropylene type resin and 10wt.% of a polypropylene type soft resin as an inner layer are melted and extruded from respective single-screw extruders and the molten resins of respective layers are allowed to meet with each other in a feed block and subjected to extrusion molding through a T-die and the thicknesses of respective layers are successively set to 25,10 and 40μm from the outer layer.
申请公布号 JPH1095038(A) 申请公布日期 1998.04.14
申请号 JP19960252001 申请日期 1996.09.24
申请人 SEKISUI CHEM CO LTD 发明人 TANAKA HIDEAKI;TADA HIROSHI
分类号 B65D81/24;B29C47/06;B29C47/14;B29L7/00;B29L9/00;B32B27/32;B32B27/34;(IPC1-7):B29C47/06 主分类号 B65D81/24
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