| 摘要 |
PROBLEM TO BE SOLVED: To simply operate a soldering iron to connect the leads of a Peltier element to a terminal wiring of a semiconductor hermetic sealing package by fixing previously a lead made of a soldering metal to the wiring and protruding it inwards. SOLUTION: An inward lead 14 is fixed to a groove 23, and Peltier element lead 13 is soldered thereto, such that the straight short lead 14 is inserted in the groove 23 and fixed to a wiring 1 with an Ag solder 15, thereby electrically connecting the lead 14 to the wiring 1. The lead 14 is a Cu wire superior in conductivity and plated with Ni. The Peltier element is mounted in such a package, and its lead 13 is bent and soldered to the top end of the inward lead 14. The lead 14 has been mounted previously sidewards and are not mistakenly handled so as to sufficiently simplify the soldering operation for an unskilled person to solder. |
