| 摘要 |
PROBLEM TO BE SOLVED: To inject an insulation resin in a short time and improve the productivity. SOLUTION: In this semiconductor mounting method, where a semiconductor chip 11 is jointed with a wiring board 12 through face-down bonding, a semiconductor mounting part 14 to be mounted with the chip 11 is provided with an electrode pad 15, and the periphery of the part 14 is covered with a solder resist 16. A semiconductor chip 11 is mounted to the part 14 of the board 12 of such a structure, that it is electrically connected with the pad 15. Further, an insulation resin 17 is filled into a clearance between the chip 11 and board 12 from the periphery of the chip 11, and the resin 17 is cured through heating.
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