| 摘要 |
PROBLEM TO BE SOLVED: To improve the throughput of wafer processing by actually reducing the time required for wafer replacement. SOLUTION: A wafer transportation robot 8 set in a preliminary exhausting chamber 2, provided with a first chuck 5 and a second chuck 7, can holds two wafers at the same time. Thus, in succession to taking out of a processed wafer with the second chuck 7 in a vacuum chamber 1, loads unprocessed wafer prepared in the first chuck 5 into the vacuum chamber 1. While wafer processing is being performed in the vacuum chamber 1, the processed wafer is ejected from the second chuck 7 into a wafer cassette 3 in the outside of a device, then, the next wafer to be processed is loaded into the first chuck 5 for the next process. |
