| 摘要 |
PROBLEM TO BE SOLVED: To simplify an assembling equipment and reduce manday by tentatively putting a photo IC chip optically combined with an optical fiber on a chip putting stage provided on a base stage and packaging it on a work stage provided side by side. SOLUTION: This assembling jig 70 is formed in box shape provided with side walls 72 in 4 sides and open upper face. On the bottom plate, a chip putting stage 76 and a packaging work stage 78 of synthetic resin are provided in one unit. The packaging work stage 78 has a package body putting stage 78A and a lid putting stage 78B, on which package body and lid member are put and fixed, respectively. By this, in the package body put on the putting stage 78A and fixed, a photo IC chip optically combined with an optical fiber and tentatively put on 76 is contained. Then, the lid member of the package put on the putting stage 78B and fixed is removed and put over the package body to connect to be a package. In this manner, each putting stage for the package body and the lid member to connect are respectively provided to the assembling jig 10 and so the assembling equipment can be simplified and manday can be reduced. |
