SEMICONDUCTOR PACKAGE OF CHIP SCALE AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To realize low manufacturing cost and mass production by using wire bonding connection, a printed circuit substrate and a dam carrier. SOLUTION: A semiconductor chip 130 is bonded to a lower part surface of a circuit substrate 120a, and wire-boned at a center opening part of the circuit substrate 120a of a semi-circuit wiring 121. As a sealing means, a potting resin 161 and a sealing rid are used, and using a dam 115 while being bonded, a sealing process is controlled and the sealing means can be positioned lower than the upper part of an external connection terminal 170 comprising a metal bump and a solder ball. The dam is also used as a dam carrier for package manufacturing, and individual packages are separated from plural packages by cutting at a tie-bar 113.