| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket which holds reliable contact with an IC package having a spherical bump. SOLUTION: An IC socket has a contact part 5 opposed to the bottom spherical surface of a spherical bump 2 at the tip of an elastic contact pin 4 arranged in its socket body, a recessed part 8 formed in the contact part 5 for bringing the bottom dead center of the spherical bump 2 free of contact, and a contact end situated on the circumference of the recessed part 8 and contacting under pressure at plural points or annularly with the bottom spherical surface of the spherical bump 2 around the bottom dead center. The contact part 5 having the contact end lies diametrally within the bottom spherical surface.
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