发明名称 Semiconductor device incorporating a capacitor formed in a ramiform gap
摘要 A semiconductor device with holes of porous texture in a part of the surface of a semiconductor substrate. The holes are filled with a conductive material across an insulating layer.
申请公布号 US5739565(A) 申请公布日期 1998.04.14
申请号 US19940365318 申请日期 1994.12.28
申请人 CANON KABUSHIKI KAISHA 发明人 NAKAMURA, YOSHIO;MIYAWAKI, MAMORU;UENO, ISAMU
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/10;H01L27/108;(IPC1-7):H01L27/108;H01L29/76;H01L29/94;H01L31/119 主分类号 H01L27/04
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