| 摘要 |
PROBLEM TO BE SOLVED: To provide a molding-type semiconductor device, wherein even at a frequency of microwave band or above, stable operation and versatility are imparted. SOLUTION: A lead frame on which a semiconductor chip 1 is mounted is divided into plural lead frame parts 2 and 3 so as to separate a circuit which generates high-frequency noises from other circuit, with earth leads 5-8 led out to each external circuit from the lead frame parts 2 and 3 being provided. Though the high-frequency noises creep into other circuits through the earth leads 5-8, an account of the inductance of the earth leads 5-8, noise signal level is reduced, reducing affect on other circuit. |
