| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent disturbances to a wiring formed on a circuit board by providing a circuit board, which has a thermal conductive layer for radiation with a high thermal conductivity provided in an insulating layer, then forming an aperture for exposing the thermal conductive layer in the insulating layer, and conducting the heat of an electronic component mounted on the circuit board to the thermal conductive layer from the aperture. SOLUTION: A circuit board 23 is formed in a multilayer structure in which a thermal conductive layer 25 for radiation with a high thermal conductivity and a signal wiring layer 26 are buried in an insulating layer 24. On the surface of the circuit board 23, an aperture 34 is formed for exposing the thermal conductive layer 25 in the insulating layer 24 to a mounting portion of a TCP component 27. In addition, a metal plate (thermal conduction means) 35, having substantially the same size as a semiconductor ship 29 and having high thermal conductivity, is mounted in a buried state in the aperture 34 of the circuit board 23. When a personal computer is operated, the semiconductor chip 29 of the TCP component 27 is heated. In this case, the heat of the semiconductor chip 29 is conducted to the thermal conductive layer 25 in the insulating layer 24, through the metal plate 35 in the aperture 34 on the surface side of the circuit board 23.</p> |
