| 摘要 |
<p>PROBLEM TO BE SOLVED: To restrain a copper foil, laminated on an insulating film of polyimide from being deformed by a method, wherein a nearly square slit-like opening whose width is larger than a length between the edge of a device hole and the tip of an inner lead is provided to an insulating film. SOLUTION: Copper foils 2 and 3 are laminated on both the sides of a polyimide film 1 respectively. Then, a nearly square device hole pattern 4 is provided to the copper foil 3. At this point, the width of a slit 5 of the device hole pattern 4 is larger than a length between the edge of the device hole and the tip of an inner lead. Then, for example, a carbon gas laser beam is made to scan the device hole pattern 4, whereby a part of the polyimide film 1 corresponding to the device hole pattern 4 is removed to form the slit 5. Then, the disused polyimide film 1 is removed from the device hole pattern 4, a pair of inner leads 6 and 6 whose tips confront each other are formed of the copper foil 2, and thus a device hole 7 is finished finally.</p> |
