| 发明名称 |
Electrical circuit board and circuit board assembly |
| 摘要 |
An electrical circuit board (100) includes a substrate (101) on which a metallized bar code pattern (104) is disposed. The substrate (101) further includes an electrical circuit metallization pattern (103) which incorporates at least a portion of the metallized bar code pattern (104).
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| 申请公布号 |
US5740066(A) |
申请公布日期 |
1998.04.14 |
| 申请号 |
US19950497974 |
申请日期 |
1995.07.03 |
| 申请人 |
MOTOROLA, INC. |
发明人 |
SUPPELSA, ANTHONY J.;SUPPELSA, ANTHONY B.;LIEBMAN, HENRY F.;COOK, JOHN M. |
| 分类号 |
G06K19/06;H05K1/02;H05K1/11;(IPC1-7):H05K1/00 |
主分类号 |
G06K19/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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