| 摘要 |
PROBLEM TO BE SOLVED: To perform the (i) radiation exposure and the formation of a thickn film by forming a photosensitive polyimide precursor resin composition film containing a polyimide precursor with specified repeating unit on a base, an ion bonding photosensitive compound and an optical radical initiator, light exposing and heat curing, and then heat and pressure fixing an adherend. SOLUTION: A polyimide precursor is provided with the repeating unit represented by the formula I. In the formula I, R<1> represents a tetravalent organic group, and R<2> represents a bivalent organic group, and 50% or more of R<2> represents a tetravalent organic group (condition 1) represented by the formula II, or 50% or more of R<2> represents a bivalent organic group represented by the formula III or a bivalent organic group (condition 2) represented by the formula IV or a group satisfying both of above-referred conditions (condition 1 and condition 2). In the formulas II and III, X and Y represent -O-, -CO-, -CH2 - or -SO2 -, and (m) represents 0 or 1-4 integers. Also in the formula IV, Z represents hydrogen or 1-3C alkyl group individually, and (l) represents 1-4 integers. |
