Engagement assembly for connecting a heat dissipation device to an integrated circuits

摘要

An engagement assembly includes an engaging plate mounted to a holed fin of each of the two outermost opposite rows of fins of a finned plate. Each engaging plate includes at least one first slot defined in a lower portion thereof for releasably engaging with an associated protrusion on a pin seat and a second slot defined in a mediate portion thereof. A press plate is mounted outside each engaging plate and includes an eccentric hole defined therein. A positioning element is extended through the eccentric hole of each press plate, the second slot of the associated engaging plate, and the hole of the associated holed fin. When the press plate is rotated through a pre-determined angle rotated about the positioning element to bear against a lip formed on a top of the associated engaging plate, the engaging plate is moved upwardly such that the first slot of the engaging plate firmly engages with the associated protrusion.