发明名称 Positive photoresist composition
摘要 The present invention provides a positive photoresist composition exhibiting superior sensitivity, definition and thermostability, and in addition, having excellent focal depth range properties. The positive photoresist composition comprises (A) an alkali-soluble resin; (B) a quinonediazide group-containing compound; and (C), for example, bis(4-hydroxy-2,3,5-trimethylphenyl)-2-hydroxyphenylmethane.
申请公布号 US5738968(A) 申请公布日期 1998.04.14
申请号 US19970823585 申请日期 1997.03.25
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 HOSODA, HIROSHI;HIRAYAMA, TAKU;DOI, KOUSUKE;NIIKURA, SATOSHI;KOHARA, HIDEKATSU;NAKAYAMA, TOSHIMASA
分类号 G03F7/004;G03F7/022;H01L21/027;(IPC1-7):G03F7/023 主分类号 G03F7/004
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