发明名称 GOLD ALLOY WIRE FOR WEDGE BONDING
摘要 PROBLEM TO BE SOLVED: To obtain joint strength sufficiently large to realize wedge bonding by using a gold alloy wire. SOLUTION: This gold alloy wire contains 1 to 100 wt.ppm of calcium(Ca) and 0.2 to 5.0wt.% of at least one kind of paradium(Pd), silver(Ag) and platinum(Pt), and the remaining part is an essential impurity. Its tensile strength is set to 33.0kg/mm<2> or more, and the elongation thereof is 1 set to 3%. Further, it may be added with at least one kind of 1 to 100 wt.ppm out of Mg, Y, La, Eu, Ge, and Be.
申请公布号 JPH1098062(A) 申请公布日期 1998.04.14
申请号 JP19970206161 申请日期 1997.07.31
申请人 TANAKA DENSHI KOGYO KK 发明人 KIKUCHI TERUO;ISHII KOKICHI
分类号 H01L21/60 主分类号 H01L21/60
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