| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device and its production method, by which a highly reliable TCP(tape carrier package) structure can be realized by improving flow of resin to the rear surface of a tape and suppressing the generation of cracks during a temperature cycle testing. SOLUTION: This semiconductor package of TCP structure is formed of a semiconductor chip 1, where a plurality of bumps 5 are formed on the main surface, a tape carrier 2 where a wiring 9 is formed on the main surface of a tape 7, and a solder resist 3 formed on the main surface of the tape carrier 2. The bumps 5 of the semiconductor chip 1 is connected with an inner lead 10 of the wiring 9 of the tape carrier 2, and the connected part is filled with a resin 4, forming a package structure. Further, on the main surface of the chip 1, a load-side end part, provided with the bumps 5 is made to be stepped 6, and the stepped horizontal part is overlapped with the end part on the opening side of the tape carrier 2 with a specified clearance in between.</p> |
