发明名称 High frequency masterslice monolithic integrated circuit
摘要 A monolithic integrated circuit utilizing areas associated with unused devices for wiring signal lines, thereby implementing effective wiring and improving high frequency characteristics. A common substrate consisting of a semiconductor substrate, and active devices, capacitor electrodes and resistors formed on the semiconductor substrate, is followed by a dielectric film, a ground metal, a dielectric film whose thickness is equal to or greater than 1 mu m, and signal lines. A desired circuit is formed by connecting the signal lines with electrodes of the active devices and other elements via, holes in the dielectric films, and windows of the ground metal. The windows of the ground metal are formed over portions of active devices which are used as components of the circuit.
申请公布号 US5739560(A) 申请公布日期 1998.04.14
申请号 US19950528411 申请日期 1995.09.14
申请人 NIPPON TELEGRAPH AND TELEPHONE CORPORATION 发明人 TOYODA, ICHIHIKO;TOKUMITSU, TSUNEO;NISHIKAWA, KENJIRO;KAMOGAWA, KENJI
分类号 H01L23/66;(IPC1-7):H01L27/10;H01L29/00 主分类号 H01L23/66
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