| 摘要 |
PROBLEM TO BE SOLVED: To restrain a tape-type wiring board from being warped by a method, wherein a frame-like member is provided onto a surface opposite to the surface, where a wiring pattern of an insulating member is formed. SOLUTION: An opening where a semiconductor element 1 is housed is provided to a polyimide tape near its center. A tape-type wiring board 2 is so mounted on the surface of the semiconductor element 1 opposite to its surface where a circuit is formed, as to make the semiconductor element 1 located at the center of the opening provided to the tape-type wiring board 2. The, inner leads 3 are bonded to solder bumps 6 respectively. Next, the circuit surface of the semiconductor element 1, the opening of an insulating member where the inner leads are present, and the peripheral gap of the semiconductor element 1 are sealed up with liquid resin 4, so as to improve BGA in moisture resistance and the inner leads 3 in reliability. A frame-like member 5 is jointed to the surface of a tape-type BGA formed as described opposite to its surface where a circuit is formed. By this setup, the tape-type board 2 can be protected against warping, and the solder bumps 6 can be prevented form deteriorating in fatigue strength. |
