HYBRID INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To align a flexible sheet by providing bumps on a metallic substrate and flexible sheet, having fixing holes at the bumps. SOLUTION: Bumps 30, 31 are provided on a mounting surface of a lower metal substrate 10 having conductive paths 12, conductive pads 13, conductive lands 14 and outer lead pads 15. Conductive paths 22, conductive pads 23 and conductive lands 24 are provided on the surface of a flexible sheet 11, semiconductor elements 26 are connected through solder etc., to the lands 24 on a mounting surface of the sheet 11, and fixing holes 32, 33 are formed on this surface and fitted to the bumps 30, 31 of the substrate 10, thereby aligning the sheet 11. Thus it is possible to easily fix the sheet 11 to the substrate 10.