| 摘要 |
PROBLEM TO BE SOLVED: To prevent cracks appearing from extending to an element region at the time of dicing. SOLUTION: Using a blade 40 which is narrower in width than the width W of a processed region E between electrodes of devices, an electrode 7 of each device is diced to 15μm depth in the surface of a sapphire substrate 1, along a dicing line 20 set at the center of the processed region E to form a separating recess 16. At that time, in a region G between the side face 40 a of the blade 40 and a side wall 81 of an electrode formation region A, a first contact layer 63, a second contact layer 62, a p-type layer 61, a light-emitting layer 5, and an n-type layer 4 exist. Therefore, the stress concentrates on a cross line B, between the electrode formation region A and the side wall 81 which forms an L shape with the electrode formation region A, and a crack C appearing at the time of dicing is formed toward the cross line B. As a result, the crack C does not extend to the electrode formation region A or under and electrode 8, thereby inhibiting to block a current channel of the electrode 8 by the crack C. |
