Verfahren zur Flipchip-Kontaktierung eines Halbleiterchips mit geringer Anschlußzahl
摘要
Firstly, an isolating polymer paste (5) is imprinted on the face of the chip (2) by means of serigraphy. Bond pads (3) are spared. Then connecting lands (4) are imprinted by means of serigraphy, respectively covering the bond pads (3) and a relatively large part of the isolating polymer paste (5).
申请公布号
DE19639934(A1)
申请公布日期
1998.04.09
申请号
DE1996139934
申请日期
1996.09.27
申请人
SIEMENS AG, 80333 MUENCHEN, DE
发明人
JANSSEUNE, LUC, BRUGGE, BE;BRAND, ROBERT, 68794 OBERHAUSEN-RHEINHAUSEN, DE
