Chip card module

摘要

Disclosed is a chip card module comprising, apart from the printed conductors (4) and a card frame (2), one or more semi-conductor chips (3, 3') and possibly a rigidizing frame (5). The semi-conductor chip(s) and/or the rigidizing frame are fixed using a glue (6) to which particles of a set diameter are added to be used as a spacer. The glue (6) is preferably elastic and, in the preferred embodiment, the particle material is deformable. The advantage of the present invention is that the chip(s) and/or the rigidizing frame are glued with a given regular spacing in relation to the base. The elastic glue and the deformable particles adapt the deformations of the chip card module, thereby preventing the surfaces glued together from being damaged.