| 摘要 |
<p>A press-bonding apparatus which can uniformly press the entire surface areas of electronic components such as a liquid crystal driving IC, a heat seal, etc., onto a liquid crystal panel and can bond them evenly by a simple construction. A panel support table (1) is fixed to the upper end of an elevation rod (32) erected vertically movably to a table (28). The panel support table (1) is supported by a spring (33) and a liquid crystal panel (2) is placed on this support table (1). The liquid crystal panel (2) is balanced and stops at a position at which an extension portion (3c) of a transparent substrate comes into contact with, or comes close to, the upper end of a panel receiving table (4). An IC (15) which is tentatively bonded to the substrate (3c) is pushed to the substrate (3c) by a descending press-bonding head (8) and is bonded. Since the panel support table (1) is supported by the spring (33), it can move freely in such a manner as to follow the movement of the press-bonding head (8). Therefore, the IC (15) can be pushed to the liquid crystal panel always stably under a constant state.</p> |
