| 摘要 |
<p>A magnetron sputtering source for forming a sputtered film on a substrate in a magnetron sputtering apparatus includes a target having a surface from which material is sputtered and a magnet assembly (24) that is rotatable about an axis of rotation with respect to the target. The magnet assembly (24) produces on the target an erosion profile that is calculated to yield a desired depositional thickness distribution and inventory. A method for configuring the rotatable magnet assembly (24) includes the steps of determining an optimal erosion profile that yields the desired depositional thickness distribution and inventory, determining a plasma track on the surface of the target that produces an acceptable approximate to the optimal erosion profile, and determining a magnet structure that produces the plasma track.</p> |
