| 发明名称 |
High gold@ content yellow solder alloy for dentistry and jewellery |
| 摘要 |
A high gold content, yellow solder alloy used in dentistry or jewellery is free of Pd, Cu, Ni and Cd and comprises (by wt.) 55-72% Au, 0.5-5% Pt, 2-20% Ag, 0-0.5% Ir, Rh, Ru and/or Re, 14.5-20% Zn, 0-5% Sn and 0-5% In, with the proviso that the total amount of Zn, Sn and In is 14.5-20%. |
| 申请公布号 |
DE19640169(A1) |
申请公布日期 |
1998.04.09 |
| 申请号 |
DE1996140169 |
申请日期 |
1996.09.28 |
| 申请人 |
DEGUSSA AG, 60311 FRANKFURT, DE |
发明人 |
GRAU, FRANZ-JOSEF, DR., 91077 NEUNKIRCHEN AM BRAND, DE;KLAUS, ANGELA, 63456 HANAU, DE;STEINKE, RUDI, 63457 HANAU, DE |
| 分类号 |
A61K6/04;B23K35/30;C22C5/02;(IPC1-7):B23K35/30;A61C5/00;A61C13/00;A61K6/00 |
主分类号 |
A61K6/04 |
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