PHOTODETECTING CHIP AND ITS USE

摘要

The invention concerns a photodetecting chip, with a photosensitive semiconductor structure (1) on a first main surface(2) of a substrate (3). The material of the substrate (3) is at least semitransparent so that it can detect a beam. The coupling of the beam to be detected (4) is carried through a first front face (10) of the substrate. The substrate (3) has a beam deflecting surface (5) lying inclined with respect to the first main surface (2) of the substrate (3) and deflecting the beam to be detected (4) to the photosensitive semiconductor structure (1).