CHIP MODULE ESPECIALLY FOR IMPLANTATION IN CHIP CARD BODY
摘要
Disclosed is a chip module, especially for implantation in the body of a chip card (25) comprising a carrier (10) and a chip (13) placed thereon. Disclosed chip module is characterized by base-type elevation (23) which encompasses chip either entirely or partially.
申请公布号
WO9815004(A1)
申请公布日期
1998.04.09
申请号
WO1997DE01921
申请日期
1997.09.02
申请人
SIEMENS AKTIENGESELLSCHAFT;HOUDEAU, DETLEF;STAMPKA, PETER;HUBER, MICHAEL;HEITZER, JOSEF
发明人
HOUDEAU, DETLEF;STAMPKA, PETER;HUBER, MICHAEL;HEITZER, JOSEF
