| 摘要 |
The method involves placing the wafers (2) of a cut block (1) attached b a heel section (3) to s cutting support (4,5). A cutting station (6-8) has a cutter (7,15) to cut the heel and a drive (6) moves the wafers with respect to the cutter to present the wafers individually to a cutter to detach the wafers one by one from the heel sections. A collector (9,10) collects each detached wafer and places it in an empty case of the cassette. There can be a support plate (4) on which the cut block is placed and which is mounted on the cutter base. |
