发明名称 Ohmic contact to n-GaN related compound semiconductor and its manufacturing method
摘要 A base layer (7) of electrode made of at least a metal selected from V, Nb, Zr, and Cr or an alloy containing such metal on an n-type GaN compound semiconductor layer (2). Further, a main electrode layer made (8) of other metal is formed on the base layer (7). Then, an n electrode is formed by subjecting the semiconductor layer (2), the base layer (7), and the main electrode layer (8) to a heat treatment.
申请公布号 EP0834929(A2) 申请公布日期 1998.04.08
申请号 EP19970117270 申请日期 1997.10.06
申请人 TOYODA GOSEI CO., LTD. 发明人 UEMURA, TOSHIYA;SHIBATA, NAOKI
分类号 H01L21/285;H01L21/3065;H01L33/06;H01L33/32;H01L33/42;H01S5/042;H01S5/323;H01L21/302;(IPC1-7):H01L33/00;H01S3/025 主分类号 H01L21/285
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