METODE DAN ALAT UNTUK MENGHILANGKAN BUTIR-BUTIR SOLDER SECARA MEKANIK PADA PERMUKAAN PAPAN-PAPAN RANGKAIAN YANG DICETAK

摘要

The method for mechanical removal of solder globules from the surface of circuit boards (10) that have undergone wave soldering in a soldering installation is characterised by the fact that solder globules (14) are mechanically removed by means of at least one cold gas jet (50) directed onto the surface. The apparatus for implementation of the method is characterised by the presence of a cold-gas mixer whose inlet side is connected by means of two lines to at least one tank of a liquefied gas or gas mixture, while its outlet side is connected to at least one nozzle directed onto the surface of circuit boards (10). The mixer incorporates a mixing chamber with a gas inlet and a cold-gas outlet, and a unit for introduction of liquefied gas into the mixing chamber.