发明名称 |
Process for forming silica film and composition therefor |
摘要 |
<p>A process for forming a silica film on a substrate, comprising the steps of preparing a liquid composition comprising silicic acid, water, an alkali and an organic solvent, said liquid composition having a volume ratio of water to the organic solvent in a range of 0.2 to 10.0 and a concentration of silicon element in a range of 0.0001 to 5.0 mol/l; contacting a surface of a substrate with the liquid composition; and maintaining the contact between the surface of the substrate with the liquid composition to selectively deposit silica on the surface of the substrate until a silica film is formed on the surface of the substrate.</p> |
申请公布号 |
EP0834488(A1) |
申请公布日期 |
1998.04.08 |
申请号 |
EP19970117185 |
申请日期 |
1997.10.02 |
申请人 |
SHOWA DENKO KABUSHIKI KAISHA |
发明人 |
YANO, KOTARO;SAITO, YASUO, SHOWA DENKO K.K.;KAWASAKI, KEIJI |
分类号 |
C03C17/30;C04B41/50;C23C18/00;(IPC1-7):C04B41/50 |
主分类号 |
C03C17/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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