发明名称 Process for forming silica film and composition therefor
摘要 <p>A process for forming a silica film on a substrate, comprising the steps of preparing a liquid composition comprising silicic acid, water, an alkali and an organic solvent, said liquid composition having a volume ratio of water to the organic solvent in a range of 0.2 to 10.0 and a concentration of silicon element in a range of 0.0001 to 5.0 mol/l; contacting a surface of a substrate with the liquid composition; and maintaining the contact between the surface of the substrate with the liquid composition to selectively deposit silica on the surface of the substrate until a silica film is formed on the surface of the substrate.</p>
申请公布号 EP0834488(A1) 申请公布日期 1998.04.08
申请号 EP19970117185 申请日期 1997.10.02
申请人 SHOWA DENKO KABUSHIKI KAISHA 发明人 YANO, KOTARO;SAITO, YASUO, SHOWA DENKO K.K.;KAWASAKI, KEIJI
分类号 C03C17/30;C04B41/50;C23C18/00;(IPC1-7):C04B41/50 主分类号 C03C17/30
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