| 摘要 |
A semiconductor device includes a semiconductor substrate (1a) having a first main surface; and a thermoplastic conductive resin layer (7a) comprising thermoplastic resin including particles comprising conductive material disposed on a first main surface of the semiconductor substrate (1a). Therefore, positional deviation of the semiconductor device with a resin layer while die-bonding the semiconductor device is dispensed with, thereby increasing the fabrication yield. In addition, an apparatus and a process for disposing resin on a package can be omitted, thereby the die-bonding can be performed at a low cost. <IMAGE> |
