| 摘要 |
PROBLEM TO BE SOLVED: To measure accurately the polishing amount of an object to be polished by measuring the position of the rear side of a polishing standard relative to the position of the rear side of an object to be polished. SOLUTION: A polishing amount measuring device which is used for an apparatus which polishes an object to be polished 1 by contacting the object 1 with a polishing cloth 4 placed on a surface plate 3 and causing the object 1 to perform a relative motion comprises polishing amount measuring means 18 and 19 which measure the polishing amount of a polishing standard 8 which is polished together with an object to be polished 1 on the polishing cloth 4 and position measuring means 14, 15 and 16 which measure the relative positions of the rear side of the object to be polished 1 and that of the polishing standard 8, and measures the polishing amount of the object to be polished from the polishing amount of the polishing standard 8 and the relative positions of the rear side of the object to be polished 1 and that of the polishing standard 8. |
