| 摘要 |
<p>PROBLEM TO BE SOLVED: To suck a substrate in such a way as the substrate is free from pattern damage or substrate breakage. SOLUTION: The adsorption surface of a suction plate 1 is divided into a plurality of blocks A, B and C. The adsorption ports 5 of the respective blocks A, B and C are connected with exhaust pipes 15a, 15b and 15c corresponding to the respective blocks. Furthermore, each block is provided with vacuum sensors 20a, 20b and 20c and valves 30a, 30b and 30c. All vacuum sensors 20a, 20b and 20c and valves 30a, 30b and 30c are connected with a CPU so that the operation control for adsorption and release of adsorption is performed. And, it is possible to perform independent adsorption and release of adsorption for the respective blocks A, B and C and to set the timing of adsorption or release of adsorption for the respective blocks A, B and C. And, since adsorption of a substrate 10 is successively performed for the respective blocks A, B and C, the substrate 10 is free from the occurrence of damage of the pattern or breakage of the substrate 10.</p> |
