Apparatus, method and system for thermal management of an unpackaged semiconductor device

摘要

A thermal management structure to provide mechanical isolation and heat removal for a unpackaged semiconductor die mounted directly on a printed circuit board substrate. The thermal management structure sandwiches the unpackaged semiconductor die and substrate between two heat sink pieces which are rigidly mounted to the substrate, thereby mechanically isolating the unpackaged semiconductor die and preventing the die from being accidentally touched. The two heat sink pieces further compliantly thermally engage selected sites on the exposed face of the semiconductor die and the surface of the substrate to conductively remove heat away from the substrate. The thermal management structure may also thermally engage selected thermally conductive components within an end product to spread the heat more uniformly throughout the system.