| 发明名称 |
Method of forming conductive bumps on die for flip chip applications |
| 摘要 |
The present invention relates to an improved method for forming a UBM pads and solder bump connections for flip chip which eliminates at least one mask step required in standard UBM pad forming processes. The method also includes repatterning bond pad locations.
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| 申请公布号 |
US5736456(A) |
申请公布日期 |
1998.04.07 |
| 申请号 |
US19960682141 |
申请日期 |
1996.07.17 |
| 申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
AKRAM, SALMAN |
| 分类号 |
H01L21/60;H01L23/485;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/60 |
| 代理机构 |
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| 地址 |
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