| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacture for an electrode body which lightens a working process and remarkably improves workability, quality and manufacture costs. SOLUTION: A double-layer substrate 33 is etched thereby to form a required wiring patterns 34. A resist 3 is applied to a part except an IC-mounting part 31. The IC-mounting part 31 is processed by plating. Subsequently, an antistatic sliding coat layer 4 is formed in the periphery of a part of a rear face of an insulating substrate 2 where openings 5 are to be formed. The openings 5 are then formed by an excimer laser. Moreover, a surface of the plated layer of the IC-mounting part 31 is cleaned by cyan cleaning or the like manner, and thereafter a driving element 35 and the IC-mounting part 31 are bonded via a wire 36, e.g. by wire bonding. |
